Eom, Yong-sung: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis

Yoon, Hyungseok, Choi, Kwang-Seong, Bae, Hyun-Cheol, Moon, Jong-Tae, Eom, Yong-Sung, Jeon, Insu

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.70 MB

english, 2017

2

Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications

Lee, Haksun, Eom, Yong-Sung, Bae, Hyun-Cheol, Choi, Kwang-Seong, Lee, Jin Ho

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.82 MB

english, 2014

3

Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder

Ji-Won Baek, Keon-Soo Jang, Yong-Sung Eom, Jong-Tae Moon, Jong-Min Kim, Jae-Do Nam

Journal:

Microelectronic Engineering

Year:

2010

Language:

english

File:

PDF, 728 KB

english, 2010

4

Self-Powered Autonomous Wireless Sensor Node by Using Silicon-Based 3D Thermoelectric Energy Generator for Environmental Monitoring Application

Im, Jong-Pil, Kim, Jeong Hun, Lee, Jae Woo, Woo, Ji Yong, Im, Sol Yee, Kim, Yeriaron, Eom, Yong-Sung, Choi, Won Chul, Kim, Jun Soo, Moon, Seung Eon

Journal:

Year:

2020

Language:

english

File:

PDF, 10.33 MB

english, 2020

5

Characterization of polymer matrix and low melting point solder for anisotropic conductive film

Yong-Sung Eom, Ji-Won Baek, Jong-Tae Moon, Jae-Do Nam, Jong-Min Kim

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 356 KB

english, 2008

6

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Novel low-volume solder-on-pad (SoP) material and process for flip chip bonding using Au stud bumps

Choi, Kwang-Seong, Bae, Ho-Eun, Jeon, Su-Jeong, Bae, Hyun-Cheol, Eom, Yong-Sung

Year:

2012

Language:

english

File:

PDF, 1.17 MB

english, 2012

7

[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Development of low contact resistance interconnection for display applications

Lee, Haksun, Eom, Yong-Sung, Bae, Hyun-Cheol, Choi, Kwang-Seong, Lee, Jin Ho

Year:

2014

Language:

english

File:

PDF, 1.76 MB

english, 2014

8

Novel Bumping Process for Solder on Pad Technology

Choi, Kwang-Seong, Bae, Ho-Eun, Bae, Hyun-Cheol, Eom, Yong-Sung

Journal:

Year:

2013

Language:

english

File:

PDF, 847 KB

english, 2013

9

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test

Alves Braganca, Wagno, Eom, Yong-Sung, Son, Jihye, Jang, Keon-Soo, Bae, Hyun-Cheol, Moon, Seok Hwan, Choi, Kwang-Seong

Year:

2017

File:

PDF, 2.24 MB

2017

10

HV-SoP Technology for Maskless Fine-Pitch Bumping Process

Son, Jihye, Eom, Yong-Sung, Choi, Kwang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Lee, Jin-Ho

Journal:

Year:

2015

Language:

english

File:

PDF, 1.24 MB

english, 2015

11

Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder

Yong-Sung Eom, Keonsoo Jang, Jong-Tae Moon, Jae-Do Nam, Jong-Min Kim

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 282 KB

english, 2008

12

Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs

Sungil Kim, Yong-Sung Eom, Chul-Wook Lee, Yongsoon Baek, Jong-Tae Moon, Kwang-Yong Kang, Hai-Young Lee

Journal:

Journal of Lightwave Technology

Year:

2009

Language:

english

File:

PDF, 1.16 MB

english, 2009

13

Feature genes of hepatitis B virus-positive hepatocellular carcinoma, established by its molecular discrimination approach using prediction analysis of microarray

Bu-Yeo Kim, Je-Geun Lee, Sunhoo Park, Jae-Yeon Ahn, Yeun-Jin Ju, Jin-Haeng Chung, Chul Ju Han, Sook-Hyang Jeong, Young Il Yeom, Sangsoo Kim, Yong-Sung Lee, Chang-Min Kim, Eun-Mi Eom, Dong-Hee Lee, Kan

Journal:

Biochimica et Biophysica Acta (BBA) - Molecular Basis of Disease

Year:

2004

Language:

english

File:

PDF, 424 KB

english, 2004

14

Fabrication of Poly(3-hexylthiophene) Thin Films by Vapor-Phase Polymerization for Optoelectronic Device Applications

Jang, Keon-Soo, Eom, Yong-Sung, Lee, Tae-Woo, Kim, Dong O., Oh, Yong-Soo, Jung, Hyun-Chul, Nam, Jae-Do

Journal:

ACS Applied Materials & Interfaces

Year:

2009

Language:

english

File:

PDF, 3.03 MB

english, 2009

15

[IEEE 2003 IEEE/LEOS International Conference on Optical MEMS - Waikoloa, HI, USA (18-21 Aug. 2003)] 2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682) - Packaging technology for wavelength tunable filter based on optical MEMS

Yong-Sung Eom,, Jong-Hyun Lee,, Byung-Suk Choi,, Jong-Deog Kim,, Ho-Gyeong Yun,, Kwang-Seong Choi,, Jong-Tae Moon,, Myung-Lae Lee,, Chang-Auck Choi,, Chi-Hoon Jun,

Year:

2003

Language:

english

File:

PDF, 148 KB

english, 2003

16

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Solder Bump Maker with coining process on TSV chips for 3D packages

Ki-Jun Sung,, Kwang-Seong Choi,, Byeong-Ok Lim,, Hyun-Cheol Bae,, Sun-Woo Choo,, Jong-Tae Moon,, Yong Hwan Kwon,, Eun Soo Nam,, Yong-Sung Eom,

Year:

2010

Language:

english

File:

PDF, 870 KB

english, 2010

17

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Optimized TSV process using bottom-up electroplating without wafer cracks

Lim, Byeong-Ok, Choi, Kwang-Seong, Eom, Yong-Sung, Bae, Hyun-Cheol, Jung, Sunghae, Sung, Ki-Jun, Moon, Jong-Tae

Year:

2010

Language:

english

File:

PDF, 1.19 MB

english, 2010

18

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Maskless screen printing technology for 20μm-pitch, 52InSn solder interconnections in display applications

Choi, Kwang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Eom, Yong-Sung

Year:

2014

Language:

english

File:

PDF, 1.88 MB

english, 2014

19

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - 3D SiP module using TSV and novel solder bump maker

Bae, Hyun-Cheol, Choi, Kwang-Seong, Eom, Yong-Sung, Lim, Byeong-Ok, Sung, Ki-Jun, Jung, Sunghae, Kim, Byeung-Gee, Kang, In-Soo, Moon, Jong-Tae

Year:

2010

Language:

english

File:

PDF, 1.08 MB

english, 2010

20

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding

Choi, Kwang-Seong, Sun-Woo Choo,, Jong-Jin Lee,, Ki-Jun Sung,, Hyun-Chel Bae,, Byeong-Ok Lim,, Jong-Tae Moon,, Eom, Yong-Sung

Year:

2010

Language:

english

File:

PDF, 796 KB

english, 2010

21

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Bumping and stacking processes for 3D IC using fluxfree polymer

Choi, Kwang-Seong, Sung, Ki-Jun, Bae, Hyun-Cheol, Moon, Jong-Tae, Eom, Yong-Sung

Year:

2011

Language:

english

File:

PDF, 2.38 MB

english, 2011

22

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Fine-pitch, low-volume SoP(Solder-on-Pad) process

Ho-Eun Bae,, Kwang-Seong Choi,, Hyun-Cheol Bae,, Yong-Sung Eom,, Dong-sik Bae,

Year:

2012

Language:

english

File:

PDF, 530 KB

english, 2012

23

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - 3D SiP module using TSV and novel low-volume solder-on-pad(SoP) process

Bae, Hyun-Cheol, Bae, Ho-Eun, Jeon, Su-Jeong, Jung, Kwang-Hoon, Eom, Yong-Sung, Choi, Kwang-Seong

Year:

2012

Language:

english

File:

PDF, 2.92 MB

english, 2012

24

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Characterization of hybrid underfill for low-temperature process applicable to flexible substrate

Son, Jihye, Eom, Yong-sung, Choi, Kwang-seong, Lee, Haksun, Bae, Hyun-cheol, Lee, Jin-ho

Year:

2015

Language:

english

File:

PDF, 1.29 MB

english, 2015

25

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Characterization of 3D stacked high resistivity Si interposers with polymer TSV liners for 3D RF module

Choi, Kwang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Eom, Yong-Sung, Lee, Kangwook, Fukushima, Takafumi, Koyanagi, Mitsumasa, Lee, Jin Ho

Year:

2015

Language:

english

File:

PDF, 1.08 MB

english, 2015

26

SPIE Proceedings [SPIE Photonics Europe - Strasbourg, France (Monday 3 April 2006)] Integrated Optics, Silicon Photonics, and Photonic Integrated Circuits - Polymeric variable optical attenuator based on surface plasmon polariton

Park, Suntak, Righini, Giancarlo C., Eom, Yong-Sung, Won, Hyong S., Song, Seok H.

Year:

2006

Language:

english

File:

PDF, 342 KB

english, 2006

27

Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

Yim, Byung-Seung, Kim, Jong-Min, Jeon, Sung-Ho, Lee, Seong Hyuk, Kim, Jooheon, Han, Jung-Geun, Eom, Yong-Sung, Shin, Young-Eui

Journal:

MATERIALS TRANSACTIONS

Year:

2009

Language:

english

File:

PDF, 377 KB

english, 2009

28

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs

Choi, Kwang-Seong, Moon, Seok Hwan, Eom, Yong-Sung, Bae, Hyun-Cheol, Lee, Jin Ho

Year:

2016

File:

PDF, 2.18 MB

2016

29

Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate

Bae, Hyun-Cheol, Eom, Yong-Sung, Choi, Kwang-Seong, Moon, Seung Eon, Lee, Jin Ho

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2016

Language:

english

File:

PDF, 8.28 MB

english, 2016

30

Characterization of transmission lines with through-silicon-vias and bump joints on high-resistivity Si interposers for RF three-dimensional modules

Choi, Kwang-Seong, Eom, Yong-Sung, Bae, Hyun-Cheol, Moon, Seok Hwan, Lee, Jin Ho

Journal:

Japanese Journal of Applied Physics

Year:

2016

Language:

english

File:

PDF, 3.15 MB

english, 2016

31

Interconnection Technology Based on InSn Solder for Flexible Display Applications

Choi, Kang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Eom, Yong-Sung, Lee, Jin Ho

Journal:

Year:

2015

Language:

english

File:

PDF, 1.24 MB

english, 2015

32

Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding

Lee, Haksun, Choi, Kwang-Seong, Eom, Yong-Sung, Bae, Hyun-Cheol, Lee, Jin Ho

Journal:

Year:

2016

Language:

english

File:

PDF, 7.31 MB

english, 2016

33

Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection

Jang, Keon-Soo, Eom, Yong-Sung, Choi, Kwang-Seong, Bae, Hyun-Cheol

Journal:

Industrial & Engineering Chemistry Research

Year:

2018

Language:

english

File:

PDF, 1.26 MB

english, 2018

34

Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic analysis

Jang, Keon-Soo, Eom, Yong-Sung, Choi, Kwang-Seong, Bae, Hyun-Cheol

Journal:

Journal of Applied Polymer Science

Year:

2018

Language:

english

File:

PDF, 1.19 MB

english, 2018

35

Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

Journal:

Year:

2011

Language:

english

File:

PDF, 720 KB

english, 2011

36

Crosslinkable deoxidizing hybrid adhesive of epoxy-diacid for electrical interconnections in semiconductor packaging

Jang, Keon-Soo, Eom, Yong-Sung, Choi, Kwang-Seong, Bae, Hyun-Cheol

Journal:

Polymer International

Year:

2018

Language:

english

File:

PDF, 894 KB

english, 2018

37

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

Choi, Kwang-Seong, Braganca Junior, Wagno Alves, Jeong, leeseul, Jang, Keon-Soo, Moon, Seok Hwan, Bae, Hyun-Cheol, Eom, Yong-Sung, Cho, Min Kyo, Chang, Seung Il

Year:

2018

File:

PDF, 590 KB

2018

38

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

Choi, Kwang-Seong, Braganca Junior, Wagno Alves, Jeong, leeseul, Jang, Keon-Soo, Moon, Seok Hwan, Bae, Hyun-Cheol, Eom, Yong-Sung, Cho, Min Kyo, Chang, Seung Il

Year:

2018

Language:

english

File:

PDF, 590 KB

english, 2018

39

Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

Eom, Yong-Sung, Son, Ji-Hye, Jang, Keon-Soo, Lee, Hak-Sun, Bae, Hyun-Cheol, Choi, Kwang-Seong, Choi, Heung-Soap

Journal:

Year:

2014

Language:

english

File:

PDF, 476 KB

english, 2014

40

Optimization of Material and Process for Fine Pitch LVSoP Technology

Journal:

Year:

2013

Language:

english

File:

PDF, 1.46 MB

english, 2013

41

Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder

Eom, Yong-Sung, Jang, Keon-Soo, Moon, Jong-Tae, Nam, Jae-Do

Journal:

Year:

2010

Language:

english

File:

PDF, 1.05 MB

english, 2010

42

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Low-temperature sintering behavior of ternary solder and copper powder for high-power device packaging

Eom, Yong-Sung, Jang, Keon-Soo, Son, Ji-Hye, Bae, Hyun-Cheol, Choi, Kwang-Seong

Year:

2017

File:

PDF, 424 KB

2017

43

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

Choi, Kwang-Seong, Eom, Yong-Sung, Moon, Seok Hwan, Joo, Jiho, Jeong, leeseul, Lee, Kwangjoo, Kim, Jung Hak, Kim, Ju hyeon, Yoon, Gil-Sang, Lee, Kwang-Hee, Lee, Chul-Hee, Ahn, Geun-Sik, Shim, Moo-Sup

Year:

2019

Language:

english

File:

PDF, 859 KB

english, 2019

44

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

Choi, Kwang-Seong, Eom, Yong-Sung, Moon, Seok Hwan, Joo, Jiho, Jeong, leeseul, Lee, Kwangjoo, Kim, Jung Hak, Kim, Ju hyeon, Yoon, Gil-Sang, Lee, Kwang-Hee, Lee, Chul-Hee, Ahn, Geun-Sik, Shim, Moo-Sup

Year:

2019

File:

PDF, 859 KB

2019

45

[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate

EOM, Yong-Sung, JANG, Ki-Seok, JOO, Jiho, CHOI, Kwang-Seong

Year:

2019

Language:

english

File:

PDF, 3.00 MB

english, 2019

46

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration

Choi, Kwang-Seong, Eom, Yong-Sung, Moon, Seok Hwan, Joo, Jiho, Lee, Kwangjoo, Kim, Jung Hak, Kim, Ju hyeon

Year:

2019

File:

PDF, 898 KB

2019

47

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology

Choi, Kwang-Seong, Joo, Jiho, Jang, Ki-seok, Eom, Yong-Sung, Choi, Gwang-Mun, Yun, Ho-Gyeong, Moon, Seok Hwan, Kim, Jong-Sun, Oh, Mingyun, Choi, Ji-Hoon, Choi, Ji-Woong, Cho, Sung-Yun, Choi, Shin, Par

Year:

2020

File:

PDF, 695 KB

2020

48

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology

Joo, Jiho, Eom, Yong-Sung, Jang, Ki-seok, Choi, Gwang-Mun, Choi, Kwang-Seong

Year:

2020

File:

PDF, 758 KB

2020